Innovative Products
JP SCIENCE develops high-quality products based on advanced scientific technology. Our products provide optimal solutions tailored to customer needs.
Main Products
Introducing JP SCIENCE's flagship products
Insulation Bonding Wire
JP SCIENCE's flagship product, the Insulation Bonding Wire, is a high-performance wire used in semiconductor packaging processes. It features excellent insulation properties and durability, making it optimized for high-density semiconductor products.
- Excellent insulation properties
- High heat resistance and durability
- Fine pitch application capability
- Custom manufacturing in various sizes and specifications
Product Specifications
Detailed specifications of Insulation Bonding Wire
Physical Properties
- Diameter Range15 ~ 50 μm
- Coating Thickness0.5 ~ 2.0 μm
- Tensile Strength≥ 120 MPa
- Elongation≥ 3.5%
- Thermal Expansion Coefficient14 ~ 16 ppm/°C
Electrical Properties
- Insulation Resistance≥ 10^9 Ω·cm
- Breakdown Voltage≥ 100 V
- Dielectric Constant3.2 ~ 3.8
- Dielectric Loss≤ 0.02
- Operating Temperature-65°C ~ 200°C
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